SONY_SI_P750


 

An ultracompact Sony machine that enables ultraorecision printing.

Achieve the high-quality solder print by the method of fixing the PWB board that developed from the manufacturing site. An operativeness and maintained goodness are condensed to this compact body.

Sealed structure above screen

Tight sealing minimizes cream solder degradation.(Can handle lead-free solder operations)

Perfect plate removal

A squeegee and conveyor frame hold the metallic mask to minimize vibration. An external cramp(featuring a new toothcomb mechanism)holds the board in place. This and vacuum system eliminate board gaps.

Unique cast frame with high rigidity

The structure features a high-rigidity cast needed to ensure printing precision.

·         Printing repeatability: ±10μm

·         Cycle time: 9sec+printing time

·         Board size: 50mm x 50mm330mm x 250mm

·         Screen size :650mm x 550mm

External dimensions: 975(W)mm x 765(D) x 1,340(H)mm

一个超小型的索尼机器,使ultraorecision打印。
固定板,从生产现场的工作计划和预算的方法,实现高品质的焊料打印。保持一个可操作性和善良,是一个浓缩的这个小巧的机身。
屏幕上方的密封结构
(可以处理无铅焊料操作)紧密密封最大限度地减少焊锡膏退化。
完美的钢板取出
刮刀和输送框架举行的金属面具,以尽量减少震动。外部抽筋(具有一个新的
toothcomb机制)举行董事会。这和真空系统消除板的空白。
独特的铸造框架,高刚性
的结构特点,以确保印刷精度所需的高刚性铸铁。 •印刷重复性:±10μm
•周期时间:9sec+印刷时间
•董事会尺寸:50mm x 50毫米330毫米x 250毫米
•屏幕尺寸:650毫米x550毫米
•外形尺寸:975(宽)毫米×765(深)x1340(高)mm